Application Guidelines
For maximum bond strength the surfaces should be thoroughly cleaned with a 50:50
mixture of isopropyl alcohol and water. Consult manufacturers directions for use and
precautions when using cleaning solvents.
Ideal tape application is accomplished when temperature is between 21°C and 38°C (between 70°F and 100°F) and the bond is allowed to dwell 72 hours. Initial tape application to surfaces at temperatures below 10°C (50°F) is not recommended.
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